30 days old

TCAD Engineer - (SK)

Intel
Santa Clara, CA 95050
  • Job Code
    JR0213307
Job Description

This is an exciting time to be at Intel - come join our TCAD Team and work on one of the most advanced 3DNAND and SSD technology portfolios in the world. As the global leader in the semiconductor industry, Intel possesses many industry-leading SSD technologies including the most capable Quadruple Level Cell (QLC) NAND Flash products. In this role, you will be part of a world-class team that will transition to lead the SSD business at SK Hynix.

The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intels Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix

In this role you will have the opportunity to work on the latest breakthrough in Non-Volatile Memory Technology. You will be working in a dynamic team environment that develops and applies physics- and chemistry-based modeling tools - from molecular to device level - for simulating the creation and behavior of new materials, microelectronic devices, and structures used in 3D-NAND technology. Specific duties may include development of advanced SW and applications involving numerical device and process modeling, materials modeling, thermos-mechanical modeling, equipment modeling and/or geometry and meshing infrastructure.

Areas of expertise that are applicable to this position are listed in bullet form below. A given project may combine one or more of these areas: Device: advanced device transport, quantum effects, electronic structure, novel device and memory operation, optoelectronics, mesh generation, software architecture and numerical methods for device problems. Process: defect-coupled diffusion/activation, FEM based stress simulation, Software architecture, Numerical methods for process problems. Materials modeling: computational materials science including density functional theory and molecular dynamics modeling for front end or back-end materials and processes. Thermo-mechanical: advanced mechanical and material engineering background, heat transfer model from macro-scale to nano-scale transport, thermal induced stress/strain analysis, Finite element model development experience, reliability, and material fatigue/failure research. Equipment: gas and liquid phase transport phenomena, chemistry and chemical mechanism analysis, numerical methods for chemistry/fluid-flow/species-transport/heat-transfer, parallel programming, and semiconductor processing. Meshing: computational geometry, mesh generation algorithms, graph theory, computer graphics, scientific visualization, and parallel programming.


Qualifications

Minimum Qualifications
Master's or PhD degree in Electrical Engineering, Chemical Engineering, Chemistry, Materials Science, Computer Science, Mechanical Engineering, or a related field.
5+ years of experience in modeling semiconductor device, process, materials chemistry, feature scale, equipment, thermo-mechanical modeling physics or in advanced meshing or geometry.
3+ years of experience programming in C/C++ for development positions.
2+ years of experience with scripting such as Python or equivalent.

Preferred Qualifications

Leadership/ Managerial Experience

Inside this Business Group

Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.



Other Locations

US, California, Folsom


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-04-17 Expires: 2022-05-18

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TCAD Engineer - (SK)

Intel
Santa Clara, CA 95050

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