12 days old

Test Thermal Mechanical Research and Development Manager

Phoenix, AZ 85003
  • Job Code
Job Description

Sort Test Technology Development (STTD) Test Tooling Engineering Area is seeking a group leader with strong technical background in test technology development. The successful candidate in the Test Tooling Area will build strong team, set direction and priorities for team. The candidate will be working in highly collaborative environment and will work with various stakeholders in both internal and external organizations to develop and deliver thermal mechanical tooling solutions for semiconductor test equipment to enable Intel test product roadmap. The candidate will set priorities for the team, get results across boundaries, ensure an inclusive work environment, develop employees, and manage performance. The candidate plans, provides resources for and directs activities in engineering function to meet schedules, standards, and cost. The candidate cultivates and reinforces appropriate group values, norms and behaviors as well as identifies and analyzes problems, plans, tasks, and solutions. The candidate provides guidance on employee development, performance, and productivity issues.
The candidate uses judgement on a variety of problems requiring deviation from standard practices to avoid inadequacies and erroneous decisions which would cause moderate inconvenience and expense.


Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Thermal/Mechanical/Mechatronics engineering background and experience, Bachelor of Science with at least 6+ years of relevant experience, MS with 4+ years or PhD with 2+ years of relevant experience.

  • Experience/understanding in semiconductor test methodology and processes as well as test thermal/mechanical tooling interconnect/socket, thermal kit, and handler kit technologies.

  • Experience in program/project planning, problem solving, time management and organized approach to team management.

Preferred Qualifications:

  • Experience and understanding in semiconductor test methodology and processes as well as test electrical tooling in PCB technologies, process, board design, circuitry design and layout design

  • Experience in program and project planning, problem solving, time management and organized approach to team management.

  • Building a high performing team culture which includes setting high expectations, driving accountability to those expectations with a high sense of urgency, role modeling the desired culture, leading a team to produce results.

  • Interpersonal skills, highly motivated and able to adapt to a rapidly changing environment.

  • Leadership skills to influence partners and decision makers

  • Building innovative tooling engineering team to develop and deliver mechanical tooling solutions to enable HVM (High Volume Manufacturing) roadmap.

  • Manage development of new tooling technologies including PCB high speed and high power interconnects, SIPI and Power AC or DC simulation activities supporting Tooling collaterals for Test Equipment Interfaces.

  • Creation and Maintenance of New Product Introduction (NPI) tooling processes including tooling design ratification; design rules updates, qual, validation plan and data review.

  • Creation and execution of validation and characterization plans to demonstrate the capability of the electrical solution to meet the specifications, both in a lab/bench test setting and in the HVM test equipment environment.

  • Working with multiple teams and managing projects as well as working with external suppliers.

  • Working with supplier management and design teams to complete and deliver tooling design, manufacturing and validation the various electrical solutions.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.

Posted: 2022-05-05 Expires: 2022-06-05

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Test Thermal Mechanical Research and Development Manager

Phoenix, AZ 85003

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