21 days old

Vice President, High Volume Manufacturing Global Yield

Intel
Phoenix, AZ 85003
  • Job Code
    JR0236542
Job Description

Fab Sort Manufacturing (FSM) is responsible for the production of all internal Intel silicon using some of the world's most advanced manufacturing processes. With fabs (short for fabrication facilities) in Arizona, Ireland, Israel, Oregon and 2 new greenfield in Ohio / Germany, FSM operates as a highly coordinated virtual factory network, supporting multiple technology nodes for all Intel products. FSM supports new product introductions (NPIs) for all new products entering the high volume fabs, evaluates performance of each product to enable supply commits and approves risk start memos (RSMs) for all products that begin ramp in FSM factories ahead of production qualification.

FSM is in the midst of an exciting time of growth, delivering output in support of Intel's run of record revenues in the last few years and preparing for our IDM2.0 strategy. 14nm is at max. output for a number of years. 10nm / Intel 7 ramp is the volume leader across multiple sites and is expected to remain in high-volume for multiple years; Future technologies are expected to be in HVM at a 2-year cadence going-forward and Intel is planning to grow in new site locations in Ohio and Magdeburg, Germany. Becoming a foundry of choice is part of FSM's future business strategy. With the multitude of technologies expected to be in production for Intel manufacturing and foundry and the complexity of ramping newer nodes with breakthrough technologies like EUV it is important that FSM has the leadership and capabilities to help steer the organization to win and collaborate across the FSM factory network and in the foundry business.

As part of our IDM2.0 strategy FSM is expanding its brownfield sites and starting new greenfield sites. Intel's strategy also includes becoming a key foundry player in the industry and FSM will manufacture for foundry. This job requisition is to seek a senior leader to lead the FSM HVM Yield Global organization, reporting to the FSM General Managers. This position is a Vice President (VP) in the FSM organization.
The selected candidate will partner with FSM Factory managers, FSM Yield managers, Technology Development organization to create a high pace of yield improvement in HVM phases for each technology.
The candidate must have technology development experience and demonstrated leadership skills in a large organization, as a manager of managers, including but not limited to safety, building organizational capability, technology, quality, output, and cost. The selected candidate will lead and build the FSM HVM yield global organization to include yield optimization in lithography, dry etch, diffusion, implant, thin films, metrology, CMP and Wet etch Processes for manufacturing in an IDM2.0 environment. Knowledge of device performance, sort (and IB) and class parameters is critical. The candidate is responsible for defining and executing the FSM HVM Yield roadmap in order to deliver world-leading yield targets on all technologies inclusive of foundry.
The role also includes responsibilities for resource planning activities, organization, and leadership development to grow the organizational technical capability and ensure the organization has the capability to deliver yield support to meet yield commitments and improvement roadmaps for a diverse internal and external portfolio of products and customer requirements.
The candidate must have technology vision and demonstrated ability to solve highly complex technical problems with excellent communication skills and the ability to motivate and inspire the organization.
The candidate must also have demonstrated strong ethical standards and be able to set the tone from the top. The ability to lead in a highly ambiguous and dynamic business environment is essential. The candidate will be ideally located at an FSM site.
The Candidate must have demonstrated a track record of excellence in creative problem solving, enabling new equipment capabilities, and process technology development for capability, cost and productivity improvements. Customer engagement experience is desirable.

The role also requires:
Proven ability to manage a large diverse global organization and build a culture of inclusion
Strong manufacturing, technical and development experience and leadership
Strong execution and results focus demonstrated in their career
Proven ability to build organizational capability for success now and in the future
Demonstrated ability to build a compelling vision and mission and inspire and align leaders to this
Demonstrated strong process flow knowledge, equipment and process control, matching, technology transfer and ramp expertise, Knowledge of device performance (electrical parameters), sort (and IB), and class parameters.
Strong networking and influencing skills and the ability to positively motivate teams to the highest levels of engagement
Ability to work cross-organizationally through matrix reporting structures in order to accomplish strategic objectives as well as organizational development goals
Excellent business judgment and strategic vision
Solid financial analysis skills
Strong communication skills and ability to lead in ambiguous environments
Ability to lead and solve complex cross-functional and organizational problems that require significant stakeholder engagement and influencing across the network with Technology development
Ability to lead and manage significant organizational level changes that integrate systems, processes and culture


Qualifications

Qualifications
You must possess the below minimum qualifications to be initially considered for this position.

Minimum Qualifications:
MS, or in a science or engineering field
10 years of direct factory management experience with a strong wafer fabrication technical background and must have strong experiences and knowledge in TD process engineering.

Direct engineering management experiences in High Volume Manufacturing (HVM) or Technology Development factories

Detailed understanding of model based problem solving as well as Fab process control systems and methodologies
Strong working knowledge of device physics and process technology and equipment


Preferred Qualifications:

PhD in a science or engineering field

Fab engineering experience 10nm/ 14nm/ 22nm/ or 32nm generation
Customer engagement experience from a technical perspective

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.



Other Locations

US, New Mexico, Albuquerque;US, Oregon, Hillsboro;US, Oregon, Portland


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter....



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-11-09 Expires: 2022-12-10

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Vice President, High Volume Manufacturing Global Yield

Intel
Phoenix, AZ 85003

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